[PDF.99kj] Microvias: For Low Cost, High Density Interconnects
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Microvias: For Low Cost, High Density Interconnects
John H. Lau, S.W. Ricky Lee
[PDF.ob54] Microvias: For Low Cost, High Density Interconnects
Microvias: For Low Cost, John H. Lau, S.W. Ricky Lee epub Microvias: For Low Cost, John H. Lau, S.W. Ricky Lee pdf download Microvias: For Low Cost, John H. Lau, S.W. Ricky Lee pdf file Microvias: For Low Cost, John H. Lau, S.W. Ricky Lee audiobook Microvias: For Low Cost, John H. Lau, S.W. Ricky Lee book review Microvias: For Low Cost, John H. Lau, S.W. Ricky Lee summary
| #3161299 in Books | 2001-04-26 | Original language:English | PDF # 1 | 9.10 x1.74 x6.30l,1.10 | File type: PDF | 565 pages||0 of 0 people found the following review helpful.| Useful overview of topics|By K.L. Jim|This book gives an excellent review of microvias and WLCSP technologies, with real-world examples from the electronic packaging industry. It focuses largely on how to create effective & reliable low-cost, high density interconnects in modern high speed system designs. It provides a sufficient amount of theory so that the the reader can unde|From the Back Cover|The first comprehensive and in-depth guide to microvia and wafer level chip scale package (WLCSP) technologies. This reference gives you cutting edge information on the most important developments and latest research results in applying the
State-of-the-art introduction to high-density interconnect technology
The first-ever book on this hot topic, Microvias: Low Cost, High Density Interconnects gives you a thorough look at the technology that’s changing the nature of printed circuit boards--and driving the mobile electronic revolution. A "must" for electronics and mechanical engineers, John Lau and Ricky Lee’s intensive introduction to microvia technology expertly covers all major technique...
You easily download any file type for your gadget.Microvias: For Low Cost, High Density Interconnects | John H. Lau, S.W. Ricky Lee. I was recommended this book by a dear friend of mine.