| #5415370 in Books | 2014-02-01 | Original language:English | PDF # 1 | 9.60 x1.00 x6.80l,2.20 | File type: PDF | 356 pages|
Materials, Manufacturing, Assembly and Applications for Injection Molded Circuit Carriers
You easily download any file type for your gadget.Three-Dimensional Molded Interconnect Devices (3D-MID) | Jörg Franke. A good, fresh read, highly recommended.